IEC 62769-7:2023
現(xiàn)場設(shè)備集成（FDI？）-第7部分:通信設(shè)備

Field Device Integration (FDI？) - Part 7: Communication Devices

標(biāo)準(zhǔn)號: IEC 62769-7:2023
發(fā)布: 2023年
總頁數(shù): 17頁
發(fā)布單位: 國際電工委員會
當(dāng)前最新: IEC 62769-7:2023

引用標(biāo)準(zhǔn): IEC 61804-3 IEC 61804-4 IEC 62541-100 IEC 62541-4 IEC 62541-6 IEC 62541-7 IEC 62769-1 IEC 62769-2 IEC 62769-3 IEC 62769-4:2023 IEC 62769-5 IEC TR 62541-1

適用范圍: This part of IEC 62769 specifies the elements implementing communication capabilities called Communication Devices. The overall FDI architecture is illustrated in Figure 1. The architectural components that are within the scope of this document have been highlighted in this illustration. The document scope with respect to FDI Packages is limited to Communication Devices. The Communication Server shown in Figure 1 is an example of a specific Communication Device.

術(shù)語	描述
網(wǎng)關(guān) Gateway	通信設(shè)備，能夠在不同的物理網(wǎng)絡(luò)或協(xié)議之間橋接
HTTP HTTP	超文本傳輸協(xié)議
IP IP	互聯(lián)網(wǎng)協(xié)議
PHY PHY	物理通信硬件
SNMP SNMP	簡單網(wǎng)絡(luò)管理協(xié)議