Environmental testing—Part 2: Test methods—Test J and guidance: Mould growth (English Version)
This standard replaces GB/T2423.16-2008 and is equivalent to the IEC60068-2-10:2018 international standard, which specifies the test method for mildew growth of electrical and electronic products in hot and humid environments. The main technical changes include:
Dimension | Test Method 1 | Test Method 2 |
---|---|---|
Culture Medium Type | Inorganic Salt Solution (Without Carbon Source) | Nutrient Solution (With Carbon Source) |
Applicable Scenarios | Material Antifungal Test | Surface Contamination Simulation |
Severity level | 28d/56d | Fixed at 28d |
Judgment standard | 0-3 level (mold growth area) | 0 level is the highest requirement |
The standard stipulates the use of 8 typical molds for mixed inoculation, including Aspergillus niger, Aspergillus terreus, etc. (see Table 1). The strains must be obtained from recognized collection centers, and the spore concentration must be controlled between 1×10?/mL and 2×10?/mL.
It is recommended to pass GB/T27025-2019 certification and be equipped with:
This version of the standard strengthens the biosafety management requirements, with the following major technical evolutions:
This standard and MIL-STD-810F method 508.5 together constitute the mold protection evaluation system for military and civilian products.
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